On October 19, 2023, the 29th Annual Meeting and 30th Anniversary Celebration of the Electronic Tin Solder Materials Branch of China Electronic Materials Industry Association was held in Zhuhai, Guangdong. With the theme of "Forge Ahead for 30 Years, Keep Integrity and Innovation to Win the Future", this annual meeting aims to summarize experience, commend the advanced, study and judge the situation, boost confidence, and promote the high-quality development of industry enterprises.
As the vice chairman unit and co-organizer of the Electronic Tin Solder Materials Branch, CIIC Metal Company was invited to participate in this grand event, and won many awards such as "Outstanding Contribution Enterprise", "Science and Technology Innovation Award" and "Social Contribution Award".
During the meeting, relevant experts and entrepreneurs from the industry were invited to exchange reports on various topics such as global tin market analysis and trend outlook, policies and future trends related to tin mines in Myanmar, the development path of integrated circuits in the post-Moore era, and the application of soldering materials in semiconductors.
