• ·瓦力·瓦力

    Solder Preforms
    Solder Preforms
    Gold-based Solder Preforms

    On the premise of strictly controlling dimensional tolerances and ensuring consistency in solder volume, the thinnest thickness is 0.01mm and the minimum processing size is 0.02 * 0.02mm

    Product Selection
    Detailed Introduction
    Product List

    Features & Benefits

    ·  Excellent corrosion resistance

    ·  Low vapour pressure

    ·  Excellent wetting properties

    ·  High-melting-point, and creepless

    ·  High tensile strength 

    ·  Superior thermal and electrical conductivity


    Application Industries

    Military,Semiconducto,Optical Communication,Laser,Medical Equipment,Electricity.

    Product List
    Model
    Solid Lin
    ℃
    Liquidus
    ℃
    Eutectic Alloy
    ℃
    Density
    g/cm3
    Resistivity
    µΩ.m
    Thermal Conductivity
    W/m.K
    Thermal Expansion Coefficient
    10-6/℃
    Tensile Strength
    Mpa
    Sn90Au10 / / 217 7.78 / / / 50.2
    Au80Sn20 / / 280 14.52 0.224 / 16 276
    Au75Sn25 278 332 / / / 278 / /
    Au78Sn22 278 301 / 14.18 / 278 / /
    Au79Sn21 278 289 / 14.34 / 278 / /
    Au88Ge12 / / 361 14.67 0.151 / 13.4 185
    Au80Cu20 / / 910 / / / / /
    Au50Cu50 955 970 / / / 955 / /
    Au100 / / 1064* 19.3 0.0221 / 14 138