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    Solder Preforms
    Solder Preforms
    Indium-based Solder Preforms

    Indium has good ductility and malleability, with a melting point of only 157 ℃. It can form a series of low melting eutectic solder materials with elements such as Sn, Pb, Ag, etc.

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    Features & Benefits

    ·  Low melting point

    ·  Low vapour pressure

    ·  Favorable ductility and malleability

    ·  Good thermal fatigue properties

    ·  Repeatable welding and reflow soldering at low temperature is available.

    ·  Nice resistance in drop tests 

    ·  Superior thermal conductivity


    Product Application

    Indium has a high thermal conductivity (86W / mK at 85°C). Therefore, it is widely used in thermal management, and the heat generated by electronic components can be effectively eliminated through it.

     

    ·  Vacuum electronic devices packaging

    ·  Glass packaging

    ·  Ceramic packaging

    ·  Low-temperature superconductive device packaging

    Product List
    Model
    Solid Lin
    ℃
    Liquidus
    ℃
    Eutectic Alloy
    ℃
    Density
    g/cm3
    Resistivity
    µΩ.m
    Thermal Conductivity
    W/m.K
    Thermal Expansion Coefficient
    10-6/℃
    Tensile Strength
    Mpa
    In51Bi32.5Sn16.5 / / 60 7.88 0.522 / 22 33.44
    In66.3Bi33.7 / / 73 7.99 / / / /
    Bi50Pb28Sn22 / / 100 / / / / /
    In52Sn48 120 122 / 7.3 0.147 120 20 12
    Sn50In50 118 125 / 7.3 0.147 118 20 11.86
    In80Pb15Ag5 149 154 / 7.85 / 149 / /
    In97Ag3 / / 143 7.38 0.075 / 22 5.5
    In100 / / 157 7.31 0.072 / 29 1.88
    In60Pb40 174 185 / 8.52 0.246 174 27 28.61
    Sn77.2In20Ag2.8 175 187 / 7.25 0.176 175 28 46.88
    In50Pb50 184 210 / 8.86 0.287 184 27 32.2
    Pb60In40 197 231 / 9.3 0.331 197 26 34.48